DLW5BSN351SQ2L SMD Chip Capacitor 2 Line Common Mode Choke Surface Mount 350 Ohms @ 100MHz 2A DCR 40 mOhm

Solder Paste Printing and Adhesive Application
(in mm)
When reflow soldering the chip common mode choke coils, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to damage by mechanical and thermal stress from the PCB and may crack. Standard land dimensions should be used for resist and copper foil patterns.
When flow soldering the chip common mode choke coils, apply the adhesive in accordance with the following conditions. If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering process.

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