87832-1420 Mosfet Power Module Electronics ICs Chip Integarted
Circuts
A part of stock list
| CAP 0603 150PF 50V CL10C151JB8NNNC | 800000 | SAMSUNG | AC7502D |
| CAP 0603 180PF 50V CL10B181KB8NNNC | 800000 | SAMSUNG | AA20SEE |
| RES 0805 5K9 1% RC0805FR-075K9L | 500000 | YAGEO | 1606 |
| RES 0805 20K5 1% RC0805FR-0720K5 | 500000 | YAGEO | 1606 |
| C.I LNK623PG | 10000 | POWER | 1407 |
| C.I STM32F030K6T6 | 10000 | ST | 1549 |
| DIODO ES1J-E3/61T | 180000 | VISHAY | 1642/EJ |
| CAP 0603 10PF 50V NPO 5% CL10C100JB8NNNC | 400000 | SAMSUNG | CCBET1P |
| DIODO 1N5822 AMMO | 1000000 | MIC | 307260623445 |
| TRANS BF422 | 2000 | TOS | 5F |
| DIODO 1.5KE7.5CA-E3/4 | 5000 | VISHAY | 16+ |
| CONECTOR S3B-PH-SM4-TB(LF)(SN) | 3200 | JST | 15+ |
CONEC.
BM06B-SRSS-TB(LF)(SN) | 3000 | JST | 15+ |
| CONECTOR S4B-PH-SM4-TB(LF)(SN) | 9200 | JST | 2015.11 |
| C.I A2982SLWTR-T | 3100 | ALLEGRO | 1642 |
| OPTOACOPLADOR CNY74-4H | 1000 | VISHAY | V413H68 |
| DIODO S1G-E3/61T | 18000 | VISHAY | 1632/SG |
| CI ADS7866IDBVR | 2500 | TI | A66Y |
| CI MSP430F417IPMR | 2500 | TI | 69A2P1W |
| C.I MC14584BDR2G | 3000 | ON | PAC928 |
| C.I PIC12F508-I/SN | 1000 | MICROCHIP | 1624KC6 |
| C.I LM1117IMPX-3.3/NOPB | 2000 | TI | 4ARD/N05B |
Feature
Agency Certification CSA LR19980 UL E29179
General Product Family PCB Headers Series 87832
Application Wire-to-Board Comments Contact Molex for application in
automotive industry
MolexKits Yes Overview milligrid Product Name Milli-Grid™
Physical Breakaway No Circuits (Loaded) 14 Circuits (maximum) 14
Color
- Resin Black First Mate / Last Break No Flammability 94V-0
Glow-Wire Compliant
No Guide to Mating Part No Keying to Mating Part Yes Lock to Mating
Part Yes
Material - Metal Phosphor Bronze Material - Plating Mating Gold
Material
- Plating Termination Tin Material - Resin Nylon Number of Rows 2
Orientation Vertical PCB Locator Yes PCB Retention None Packaging
Type Tube Pitch - Mating Interface (in) 0.079 In Pitch - Mating
Interface (mm) 2.00 mm Pitch - Term. Interface (in) 0.079 In Pitch
- Term. Interface (mm) 2.00 mm Plating min: Mating (µin) 15 Plating
min: Mating (µm) 0.38 Plating min: Termination (µin) 75 Plating
min: Termination (µm) 1.88
Temperature Range - Operating -55°C to +105°C
Termination Interface: Style Surface Mount Electrical Current
- Maximum per Contact 2A Voltage - Maximum 125V
Solder Process Data Duration at Max.
Process Temperature (seconds) 10 Lead-free
Process Capability Reflow Capable (SMT only) Max. Cycles at Max.
Process Temperature 1 Process Temperature max. C 260
Material Info Reference - Drawing Numbers Product Specification
PS-87831-027 Sales Drawing SD-87832-006
