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TPD4E001DBVR IC Chip Integrated Circuit Chip Program Memory

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    Buy cheap TPD4E001DBVR IC Chip Integrated Circuit Chip Program Memory from wholesalers
     
    Buy cheap TPD4E001DBVR IC Chip Integrated Circuit Chip Program Memory from wholesalers
    • Buy cheap TPD4E001DBVR IC Chip Integrated Circuit Chip Program Memory from wholesalers

    TPD4E001DBVR IC Chip Integrated Circuit Chip Program Memory

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    Brand Name : TI
    Model Number : TPD4E001DBVR
    Certification : Original Factory Pack
    Price : Negotiation
    Payment Terms : T/T, Western Union,PayPal
    Supply Ability : 9380PCS
    Delivery Time : 1 Day
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    TPD4E001DBVR IC Chip Integrated Circuit Chip Program Memory

    4-CHANNEL ESD PROTECTION ARRAY WITH 1.5-pF IO CAPACITANCE

    Features

    4-Channel ESD Clamp Array to Enhance

    System-Level ESD Protection

    • Exceeds IEC61000-4-2 (Level 4) ESD Protection Requirements

    – ±8-kV IEC 61000-4-2 Contact Discharge

    – ±15-kV IEC 61000-4-2 Air-Gap Discharge

    • ±15-kV Human-Body Model (HBM)

    • 5.5-A Peak Pulse Current (8/20-us Pulse)

    • Low 1.5-pF Input Capacitance

    • Low 1-nA (Max) Leakage Current

    • 0.9-V to 5.5-V Supply-Voltage Range

    • Space-Saving DRL, DBV, DCK, and DRS Package Options


    DESCRIPTION/ORDERING INFORMATION

    The TPD4E001 is a low-capacitance ±15-kV ESD-protection diode array designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND.


    The TPD4E001 protects against ESD pulses up to ±15-kV Human-Body Model (HBM), ±8-kV Contact Discharge, and ±15-kV Air-Gap Discharge, as specified in IEC 61000-4-2. This device has a 1.5-pF IO capacitance per channel, making it ideal for use in high-speed data IO interfaces.


    The ultra low leakage current (<1 nA max) is suitable for precision analog measurements in applications like glucose meters, heart rate monitors, etc. The TPD4E001 is available in DRL, DBV (SOT-23), DCK (SC-70), and DRS (QFN) packages and is specified for –40°C to 85°C operation.


    ABSOLUTE MAXIMUM RATINGS(1)
    VCC –0.3 7 V VI/O
    IO voltage tolerance –0.3 VCC + 0.3 V
    Tstg Storage temperature range –65 150 °C
    TJ Junction temperature 150 °C
    Infrared (15 s) 220 Bump temperature (soldering) °C
    Vapor phase (60 s) 215
    Lead temperature (soldering, 10 s) 300 °C


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