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OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage

ChongMing Group (HK) Int'l Co., Ltd
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    Buy cheap OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage from wholesalers
     
    Buy cheap OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage from wholesalers
    • Buy cheap OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage from wholesalers

    OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage

    Ask Lasest Price
    Brand Name : TI
    Model Number : OP07CP
    Certification : Original Factory Pack
    Price : Negotiation
    Payment Terms : T/T, Western Union,PayPal
    Supply Ability : 290PCS
    Delivery Time : 1 Day
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    OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage


    OP07CP Dual Operational Amplifier linear integrated circuits Ultralow Offset Voltage


    ►Low Noise

    ►No External Components Required

    ►Replaces Chopper Amplifiers at a Lower Cost

    ►Single-Chip Monolithic Fabrication

    ►Wide Input Voltage Range 0 to ±14 V Typ

    ►Wide Supply Voltage Range ±3 V to ±18 V

    ►Essentially Equivalent to Fairchild µA714

    ►Operational Amplifiers

    ►Direct Replacement for PMI OP07C and OP07D


    description

    These devices represent a breakthrough in operational amplifier performance. Low offset and long-term stability are achieved by means of a low-noise, chopperless, bipolar-input-transistor amplifier circuit. For most applications, external components are not required for offset nulling and frequency compensation. The true differential input, with a wide input voltage range and outstanding common-mode rejection, provides maximum flexibility and performance in high-noise environments and in noninverting applications. Low bias currents and extremely high input impedances are maintained over the entire temperature range. The OP07 is unsurpassed for low-noise, high-accuracy amplification of very low-level signals.


    OP07Y chip information

    These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform.


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