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LMC555 CMOS Timer

General Description

The LMC555 is a CMOS version of the industry standard 555 series general purpose timers. In addition to the standard package (SOIC, MSOP, and MDIP) the LMC555 is also available in a chip sized package (8 Bump micro SMD) using National’s micro SMD package technology. The LMC555 offers the same capability of generating accurate time delays and frequencies as the LM555 but with much lower power dissipation and supply current spikes.

When operated as a one-shot, the time delay is precisely controlled by a single external resistor and capacitor. In the stable mode the oscillation frequency and duty cycle are accurately set by two external resistors and one capacitor. The use of National Semiconductor’s LMCMOS™ process extends both the frequency range and low supply capability.

Features

• Less than 1 mW typical power dissipation at 5V supply
• 3 MHz astable frequency capability
• 1.5V supply operating voltage guaranteed
• Output fully compatible with TTL and CMOS logic at 5V supply
• Tested to −10 mA, +50 mA output current levels

• Reduced supply current spikes during output transitions
• Extremely low reset, trigger, and threshold currents
• Excellent temperature stability
• Pin-for-pin compatible with 555 series of timers
• Available in 8 pin MSOP Package and 8-Bump micro SMD package

Absolute Maximum Ratings (Notes 2, 3)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

Supply Voltage, V+ 15V

Input Voltages, V_TRIG, V_RES, V_CTRL, V_THRESH −0.3V to V_S + 0.3V

Output Voltages, V_O, V_DIS 15V

Output Current I_O, I_DIS 100 mA

Storage Temperature Range −65˚C to +150˚C

Soldering Information

MDIP Soldering (10 seconds) 260˚C

SOIC, MSOP Vapor Phase (60 sec) 215˚C

SOIC, MSOP Infrared (15 sec) 220˚C

Note: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.

Operating Ratings(Notes 2, 3)

Termperature Range −40˚C to +85˚C

Thermal Resistance (θ_JA) (Note 2)

SO, 8-lead Small Outline 169˚C/W

MSOP, 8-lead Mini Small Outline 225˚C/W

MDIP, 8-lead Molded Dip 111˚C/W

8-Bump micro SMD 220˚C/W

Maximum Allowable Power Dissipation @25˚C

MDIP-8 1126mW

SO-8 740mW

MSOP-8 555mW

8 Bump micro SMD 568mW

Block and Connection Diagrams

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